亚洲第一伊人-夜色福利站www国产在线视频-欧美日韩视频无码一区二区三-夜色一区-噜噜视频-中国人妻被两个老外三p-亚洲天堂网站在线-日韩性网站-中文字幕无码乱人伦免费-久久不射网-乌克兰少妇xxxhd做受-欧美成人免费在线视频-国产亚洲欧美在线观看-国产麻豆一区二区三区-国内自拍一二三四2021

Contact us
Send E-MAIL
Home ? Product Center ? Other ? Bare Die/Wafer ? LM5025A Die ?
A wafer, also called a slice or substrate, is a thin slice of semiconductor material, such as a crystalline silicon, used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells. The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning. Finally the individual microcircuits are separated (dicing) and packaged.

   

LM5025A Die 

  
Active Clamp Voltage Mode PWM Controller  

DIE/WAFER CHARACTERISTICS
Fabrication Attributes General Die Information
 Physical Die
 Identification		  LM5025A  Bond Pad Opening   Size  (min)  91μm x 91μm
 Die Step  A  Bond Pad Metalization  Al_ 0.5%Cu
Physical Attributes  Passivation  PECVDOX+NITRIDE
 Wafer Diameter  150mm  Back Side Metal  BARE BACK
 Die Size (Drawn)  2286μm x 2540μm         90.0mils x 100.0mils  Back Side Connection  Floating
 Thickness  254μm Nominal  
 Min Pitch  167μm Nominal  
Special Assembly Requirements:
Note: Actual die size is rounded to the nearest micron.
 
    LM5025 MDC MWC
    ACTIVE CLAMP VOLTAGE MODE PWM CONTROLLER
                          LM5025A Die封裝圖

 

Open